Taiwanese leading fabless chipmaker TSMC (Taiwan Semiconductor Manufacturing Company) and US Broadcom have inked a supply agreement, whereby TSMC will supply 300mm (12-inch) semiconductor wafers to the latter, with an expected monthly capacity of approximately 20,000 to 30,000 units, Taiwan's Economic Daily News reported on August 17. These wafers will fully occupy one of TSMC's 12-inch plants and will be used in chips for wireless communications applications - including Bluetooth, Wi-Fi (Wireless-Fidelity) / WLAN (Wireless Local Area Network), and GPS (Global Positioning System). Financial details of the deal, however, were not yet disclosed.